发明名称 |
Light emitting diode package and method of manufacturing the same |
摘要 |
Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns. |
申请公布号 |
US8610146(B2) |
申请公布日期 |
2013.12.17 |
申请号 |
US20080238663 |
申请日期 |
2008.09.26 |
申请人 |
SHIN SANG HYUN;CHOI SEOG MOON;LEE YOUNG KI;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN SANG HYUN;CHOI SEOG MOON;LEE YOUNG KI |
分类号 |
H01L33/00;H01L21/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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