| 摘要 |
The present invention relates to a COG pre-bonding apparatus for aligning the pattern electrode of chips each having an embedded drive IC and the pattern electrode of a panel such that the pattern electrodes correspond to each other prior to the COG main-bonding and pre-bonding the chip in a chip on glass (COG) process allowing the chips with the embedded drive IC to be respectively attached to a source side and a gate side of the panel and, more specifically, to a COG pre-bonding apparatus comprising: a panel supply handler for transferring, to a stage, two panels to which anisotropic conductive films (ACF) are respectively attached; a panel transfer handler for transferring two panels, wherein chips each having an embedded drive IC are pre-compressed on the source side of the two panels on stage; and a panel discharge handler for discharging two panels and transferring the two panels to a COG main-bonding apparatus, wherein chips each having an embedded drive IC are pre-compressed on the source and gate sides of the two panels on the stage. The COG pre-bonding apparatus can reduce a tact time by shortening the logistics movement and can prevent damage to the chips each having the embedded drive IC by allowing chip carriers to align the chips in a non-contact mode using a chip alignment camera before a chip tray vacuum-absorbs the chips each having the embedded drive IC and supplies the vacuum-absorbed chips to the pre-compressing part. |
