Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

摘要

Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.