发明名称 |
Semiconductor device having a copper plug |
摘要 |
Disclosed is a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. In a further embodiment, there may also be an aluminum layer between the insulation layer and copper plug. Also disclosed is a process for making the semiconductor device. |
申请公布号 |
US8610283(B2) |
申请公布日期 |
2013.12.17 |
申请号 |
US20090573183 |
申请日期 |
2009.10.05 |
申请人 |
FAROOQ MUKTA G.;KINSER EMILY R.;MELVILLE IAN D.;SEMKOW KRYSTYNA WALERIA;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FAROOQ MUKTA G.;KINSER EMILY R.;MELVILLE IAN D.;SEMKOW KRYSTYNA WALERIA |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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