发明名称 Power module substrate, power module, and method for manufacturing power module substrate
摘要 A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate.
申请公布号 US8609993(B2) 申请公布日期 2013.12.17
申请号 US20090736813 申请日期 2009.05.15
申请人 KUROMITSU YOSHIROU;AKIYAMA KAZUHIRO;KITAHARA TAKESHI;TONOMURA HIROSHI;MITSUBISHI MATERIALS CORPORATION 发明人 KUROMITSU YOSHIROU;AKIYAMA KAZUHIRO;KITAHARA TAKESHI;TONOMURA HIROSHI
分类号 H05K1/03 主分类号 H05K1/03
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