发明名称 |
Power module substrate, power module, and method for manufacturing power module substrate |
摘要 |
A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate. |
申请公布号 |
US8609993(B2) |
申请公布日期 |
2013.12.17 |
申请号 |
US20090736813 |
申请日期 |
2009.05.15 |
申请人 |
KUROMITSU YOSHIROU;AKIYAMA KAZUHIRO;KITAHARA TAKESHI;TONOMURA HIROSHI;MITSUBISHI MATERIALS CORPORATION |
发明人 |
KUROMITSU YOSHIROU;AKIYAMA KAZUHIRO;KITAHARA TAKESHI;TONOMURA HIROSHI |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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