发明名称 Modified polyamide composition containing at least one phenolic compound
摘要 The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for molding, for example in the form of granules or powder, that can be used for the production of articles by injection-molding.
申请公布号 US8609785(B2) 申请公布日期 2013.12.17
申请号 US201013503337 申请日期 2010.10.18
申请人 VERGELATI CAROLL;ANDRES OLIVIER;SCHANEN VINCENT;ODONI LUDOVIC;SOTTA PAUL;LONG DIDIER;RHODIA OPERATIONS;C.N.R.S. 发明人 VERGELATI CAROLL;ANDRES OLIVIER;SCHANEN VINCENT;ODONI LUDOVIC;SOTTA PAUL;LONG DIDIER
分类号 C08L77/00 主分类号 C08L77/00
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