| 摘要 |
Wireless electronic devices include wireless communications circuitry such as transceiver circuitry coupled to an antenna resonating element. The transceiver circuitry and the antenna element may be formed on first and second substrates, respectively. In compact wireless devices, transceiver and antenna matching circuits may be formed on the first substrate. During production testing, a radio-frequency test probe with integrated matching circuitry may be used to mate with a corresponding contact point on the first substrate. The integrated matching circuitry may include resistors, capacitors, and inductors soldered in desired series-parallel configurations within the test probe. When the test probe is mated to the contact point on the first substrate, a test unit connected to the test probe may be used to perform radio-frequency measurements to determine whether the transceiver circuitry satisfies design criteria. |
