发明名称 |
Integrated circuit package system employing multi-package module techniques |
摘要 |
An integrated circuit package system that includes: providing a first package including a first package first device and a first package second device both adjacent a first package substrate; and mounting and electrically interconnecting a second package over an electrical interconnect array formed on a substrate of the first package second device. |
申请公布号 |
US8609463(B2) |
申请公布日期 |
2013.12.17 |
申请号 |
US20070687357 |
申请日期 |
2007.03.16 |
申请人 |
KO WONJUN;AHN SEUNGYUN;MOON DONGSOO;STATS CHIPPAC LTD. |
发明人 |
KO WONJUN;AHN SEUNGYUN;MOON DONGSOO |
分类号 |
H01L25/065;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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