| 摘要 |
The present invention relates to a transfer handling technology for a flexible display panel (FDP), and more specifically, to an alignment and bonding apparatus for a flexible display panel that can easily warp, for preventing a positional error caused by the warpage when transferring and aligning the flexible display panel or when boding a target part, for example, an FPCB, TAB, Driver IC, etc., on the display panel. The alignment and bonding apparatus is configured to comprise: a handling device including a handling plate capable of moving in three axial directions, having a lifting groove, and providing vacuum for lifting the FDP when the FDP is picked and transferred, and a vacuum lifting plate capable of being attached to or detached from the lifting groove and having a plurality of vacuum lifting holes; a stage device including a stage part capable of moving in one axial direction, being fed with the FDP from the handling device, and having a lifting groove, and a vacuum lifting plate capable of being attached to or detached from the lifting groove and having a plurality of vacuum lifting holes; and a backup device including a backup lower plate having a vacuum lifting part for lifting a portion of the bottom surface of the FDP seated on the stage part by vacuum suction when the stage part moves and approaches, and a backup upper plate having a pressing jig for pressurizing the top surface of the FDP and capable of being moved in one axial direction. |
