| 摘要 |
An apparatus for continuously and simultaneously plating two kinds of metal having standard electronic potentials (e.g. for depositing Sn-Ag alloys) comprises: an anode chamber for housing an anode liquid which includes the ions of less precious first metal (e. g. Sn), but does not include more precious metal (e. g. Ag) and active anodes; a cathode chamber for housing an cathode liquid, which includes the ions of first metal (e. g. Sn) and of more precious metal (e. g. Ag), and a substrate; a separation structure, which is a separation structure arranged between the anode chamber and the cathode chamber, actually preventing the more precious metal from being transferred from the cathode liquid to the anode liquid; and fluid features and a control unit related to the fluid features which are coupled to the apparatus, formed to continuously perform electronic plating and to actually maintain the constant concentration of the components of a plating bath during the extended period of use. [Reference numerals] (AA) Vent;(BB) And;(CC) New anode liquid: H^+, Sn^2+, H_2O |
