| 摘要 |
PURPOSE: A magnetron sputtering apparatus is provided to increase the use efficiency of a target by changing the size and arrangement of a magnet to control magnetic flux. CONSTITUTION: A target (140) supplies a deposition material to a substrate which is located in the deposition location of a chamber (110). A magnet unit (170) is arranged on one side of the target and generates magnetic flux for deposition between the substrate and the magnetic unit. The magnet unit includes a plurality of main magnets (181-183) to generate main magnetic flux and at least one submagnet (191, 192). A substrate transfer support unit (130) is installed in the chamber and supports the substrate to be transferred. |
