| 发明名称 |
PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS |
| 摘要 |
<p>The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.</p> |
| 申请公布号 |
CA2875317(A1) |
申请公布日期 |
2013.12.12 |
| 申请号 |
CA20132875317 |
申请日期 |
2013.05.31 |
| 申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
BRUNNER, HEIKO;PICALEK, JAN;BEJAN, IULIA;KRAUSE, CARSTEN;BERA, HOLGER;RUCKBROD, SVEN |
| 分类号 |
C23C18/34;C23C18/50;H01L21/288 |
主分类号 |
C23C18/34 |
| 代理机构 |
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