| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which enables easy manufacturing without complicating a connection process of a bus bar, and to provide a manufacturing method of the semiconductor module.SOLUTION: A semiconductor module includes: a semiconductor chip; a wiring board 14; a mounting plate 22 on which the wiring board is mounted; a frame 16 forming a case, which houses the wiring board, with the mounting plate; and a bus bar 18 electrically connected with a wiring pattern 28 and pulled out from the case. One side wall has a protruding part 48 protruding into the frame. The bus bar includes: a first region 36a buried in the one side wall; a second region 36b extending from a first end part 36a1 of the first region to the outer side of the frame; and a third region 36c extending from a second end part 36a2 of the first region to the inner side of the frame. The third region is bent based on the shape of the wiring board side protruding part when viewed from a position of the second end part. The third region is pressure welded to the wiring pattern by attaching the mounting plate, on which the wiring board is mounted, to the frame. |
