PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which makes physical properties of a film after curing comparable favorably with performance of a film cured at high temperature, a method for producing a patterned cured film using the resin composition and electronic components.SOLUTION: A resin composition is used as a photosensitive resin composition in the above problem. The resin composition contains (a) a polybenzoxazole precursor having a repeating unit represented by the general formula (I) (where U or V denotes a divalent organic group and at least one of U and V is a group including a 1-30C aliphatic chain structure), (b) a photosensitizing agent and (c) a solvent.