发明名称 CONDUCTIVE CONNECTION MATERIAL WITH DICING SHEET FUNCTION, CONNECTION METHOD BETWEEN TERMINALS, AND ELECTRICAL AND ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To provide a conductive connection material with a dicing sheet function which can obtain excellent electrical connection between connection terminals and high insulation reliability between adjacent terminals, and has excellent productivity, and to provide a semiconductor device electrically connected using the conductive connection material.SOLUTION: A conductive connection material with a dicing sheet function is a conductive connection material with a dicing sheet function formed by laminating a dicing sheet and a conductive connection material. The conductive connection material has a lamination structure constituted by a resin composition and a metal foil selected from a solder foil or a tin foil. The semiconductor device has a conductive connection material of the conductive connection material with the dicing sheet function.
申请公布号 JP2013251562(A) 申请公布日期 2013.12.12
申请号 JP20130151212 申请日期 2013.07.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 KAGIMOTO TOMOHIRO;CHUMA TOSHIAKI
分类号 H01L21/60;H01L21/301 主分类号 H01L21/60
代理机构 代理人
主权项
地址