发明名称 |
CONDUCTIVE CONNECTION MATERIAL WITH DICING SHEET FUNCTION, CONNECTION METHOD BETWEEN TERMINALS, AND ELECTRICAL AND ELECTRONIC COMPONENTS |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive connection material with a dicing sheet function which can obtain excellent electrical connection between connection terminals and high insulation reliability between adjacent terminals, and has excellent productivity, and to provide a semiconductor device electrically connected using the conductive connection material.SOLUTION: A conductive connection material with a dicing sheet function is a conductive connection material with a dicing sheet function formed by laminating a dicing sheet and a conductive connection material. The conductive connection material has a lamination structure constituted by a resin composition and a metal foil selected from a solder foil or a tin foil. The semiconductor device has a conductive connection material of the conductive connection material with the dicing sheet function. |
申请公布号 |
JP2013251562(A) |
申请公布日期 |
2013.12.12 |
申请号 |
JP20130151212 |
申请日期 |
2013.07.22 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
KAGIMOTO TOMOHIRO;CHUMA TOSHIAKI |
分类号 |
H01L21/60;H01L21/301 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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