发明名称 Thermoforming Cover of Portable Electronic Apparatus
摘要 This disclosure concerns a thermoforming cover of portable electronic apparatus, comprising: a first transparent layer, being made by plastic material; a color layer, being printed on the first transparent layer; an adhesive layer, being covered on the color layer; and a second transparent layer, being made by plastic material, and disposed on the adhesive layer; wherein the first transparent layer can be set as substrate, and the color layer, the adhesive layer and the second transparent layer are disposed on the first transparent layer by step, then a thermoforming cover can be manufactured in a mold through thermoforming process.
申请公布号 US2013330517(A1) 申请公布日期 2013.12.12
申请号 US201213494018 申请日期 2012.06.12
申请人 HWANG SHAN-TIEN;TOPBOUND TECHNOLOGY INC. 发明人 HWANG SHAN-TIEN
分类号 B32B3/28;B29C45/14;B32B3/30;B32B27/08;B32B27/36;B32B27/40;B44C3/02;B44C3/08 主分类号 B32B3/28
代理机构 代理人
主权项
地址