THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY, METHOD FOR PRODUCING THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, METHOD FOR PRODUCING THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY, AND ELECTRONIC DEVICE

摘要

Provided are: a thermally conductive pressure-sensitive adhesive composition which is obtained by carrying out at least a polymerization reaction of a (meth)acrylic acid ester monomer (alpha1) and a crosslinking reaction of a (meth)acrylic acid ester polymer (A1) and/or a polymer that has a structural unit derived from the (meth)acrylic acid ester monomer (alpha1) in a mixed composition that contains a predetermined amount of a (meth)acrylic resin composition (A) that contains the (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (alpha1), a predetermined amount of a thermally conductive filler (B1) that has an average particle diameter of 20 mum or less and a BET specific surface area of less than 1.0 m2/g, a predetermined amount of a thermally conductive filler (B2) that has an average particle diameter of 20 mum or less and a BET specific surface area of 1.0 m2/g or more, and a predetermined amount of a polyfunctional epoxy compound (C) that has from 2 to 10,000 (inclusive) functional groups, said thermally conductive pressure-sensitive adhesive composition being not easily torn even if molded into a thin body; and a thermally conductive pressure-sensitive adhesive sheet-like molded body.