| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-contact IC medium that reliably breaks an antenna or the like of a non-contact IC medium to disable communication when a packaging material is opened.SOLUTION: A packaging material with the non-contact IC medium is formed by bonding, with an adhesion layer 15 interposed, a function-breaking packaging material 2 breaking principal functional elements of the non-contact IC medium when the packaging material is opened, to a non-contact IC medium 1 including an antenna 13 and an IC chip 14 that are provided on a one surface part of a support body 11 with a peeling layer 12 interposed therebetween. Adhesive strength between the support body 11 and the antenna 13 constituting the non-contact IC medium 1 is made smaller than adhesive strength between the function-breaking packaging material 2 and the adhesion layer 15. |
