| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of preventing breakage of a probe and cracks of a substrate without leaving a deep needle mark into each electrode of a semiconductor device of the substrate.SOLUTION: A probe device which keeps an abutting state on each electrode of a semiconductor device formed on each probe and a wafer of a probe card while keeping a decompressed state of a sealed space between the wafer and the probe card includes an ejector 23 which decompresses the sealed space. The ejector 23 has a suction port 29, a vacuum chamber 31 communicating with the suction port 29, a discharge port 34 communicating with the vacuum chamber 31, and a nozzle 32 jetting air toward the vacuum chamber 31 at high speed. The nozzle 32 faces the discharge port 34, and the suction port 29 communicates with the sealed space. |
