| 摘要 |
PROBLEM TO BE SOLVED: To reduce differences of transmission line characteristics which are caused by differences of wiring lengths.SOLUTION: A semiconductor package includes: a printed wiring board 101; and a semiconductor chip 102 having a first signal terminal 103a and a second signal terminal 103b and mounted on the printed wiring board 101. The printed wiring board 101 includes a first land 131a and a second land 131b for solder joint which are formed on a surface layer. Further, the printed wiring board 101 includes: first wiring 141a electrically connecting the first signal terminal 103a of the semiconductor chip 102 with the first land 131a; and second wiring 141b electrically connecting the second signal terminal 103b of the semiconductor chip 102 with the second land 131b. The second wiring 141b is formed so as to have a wiring length longer than that of the first wiring 141a. The second land 131b is formed so as to have a surface area larger than that of the first land 131a. |
