发明名称 |
MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH-THICKNESS COAXIAL STRUCTURES |
摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer electronic structure which comprises coaxial structures and has excellent electric characteristics.SOLUTION: A multilayer electronic structure 300 comprises: a plurality of dielectric layers 302 extending in an X-Y plane; and at least one coaxial pair of stacked posts 304 extending through at least one dielectric layer in a Z direction that is substantially perpendicular to the X-Y plane. The coaxial pair of stacked via posts comprise a central post 306 surrounded by a toroidal via post 308 separated from the central post by a separating tube 310 of dielectric material. |
申请公布号 |
JP2013251519(A) |
申请公布日期 |
2013.12.12 |
申请号 |
JP20120213730 |
申请日期 |
2012.09.27 |
申请人 |
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATES SOLUTIONS TECHNOLOGIES CO LTD |
发明人 |
DROR HURWITZ |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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