发明名称 MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH-THICKNESS COAXIAL STRUCTURES
摘要 PROBLEM TO BE SOLVED: To provide a multilayer electronic structure which comprises coaxial structures and has excellent electric characteristics.SOLUTION: A multilayer electronic structure 300 comprises: a plurality of dielectric layers 302 extending in an X-Y plane; and at least one coaxial pair of stacked posts 304 extending through at least one dielectric layer in a Z direction that is substantially perpendicular to the X-Y plane. The coaxial pair of stacked via posts comprise a central post 306 surrounded by a toroidal via post 308 separated from the central post by a separating tube 310 of dielectric material.
申请公布号 JP2013251519(A) 申请公布日期 2013.12.12
申请号 JP20120213730 申请日期 2012.09.27
申请人 ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATES SOLUTIONS TECHNOLOGIES CO LTD 发明人 DROR HURWITZ
分类号 H05K3/46 主分类号 H05K3/46
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