| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wafer cleaning device that allows a contaminated cleaning liquid retained in a lower portion of a cleaning tank to overflow outside the cleaning tank, and further to obtain a cleaning method for the cleaning tank.SOLUTION: The wafer cleaning device comprises: bubbler plates 5 that have bubbling holes for cleaning provided on front surfaces, bubbling holes for agitation having diameters larger than those of the bubbling holes for cleaning provided on rear surfaces and partition walls for separating front surface sides and rear surface sides from one another and forming chambers different from one another and are installed with the rear surfaces directed toward a bottom surface side of a cleaning tank 3; gas supply stop means for switching whether or not an inert gas is supplied to respective chambers of the front surface sides and the rear surface sides of the bubbler plates 5; a cassette detection sensor 6 for detecting whether or not a cassette is disposed inside the cleaning tank 3; and a controller 7 that supplies the inert gas to the gas supply stop means corresponding to the chambers of the front surface sides of the bubbler plates 5 when the cassette is disposed inside the cleaning tank 3, and supplies the inert gas to the gas supply stop means corresponding to the chambers of the rear surface sides of the bubbler plates 5 when the cassette is not disposed inside the cleaning tank 3. |
