| 摘要 |
PROBLEM TO BE SOLVED: To provide an external cooling chamber capable of cooling a workpiece where reflow soldering is finished while stably maintaining the low oxygen concentration of the furnace atmosphere, and to provide a reflow solder facility.SOLUTION: An external cooling chamber of this invention is disposed at the outlet side of a furnace of a reflow solder device and includes: work transfer means, a fan cooling a workpiece, and a suction air curtain nozzle. The suction air curtain nozzle suctions the atmosphere (air) in an air curtain manner at the workpiece inlet side thereby preventing the atmosphere of the external cooling chamber from flowing out in an upstream direction and affecting the atmosphere of the furnace and stably maintaining the low oxygen concentration of the furnace atmosphere. |
