| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing/die-bonding sheet capable of shortening chip-manufacturing time without damaging a chip.SOLUTION: A dicing/die-bonding sheet 10 has a dicing sheet 3 having an adhesive layer 2 on a substrate 1 and an adhesive layer 4 provided on the adhesive layer 2, where the adhesive layer 2 contains an acrylic polymer (A), a crosslinking agent (B) and a plasticizer (C), the acrylic polymer (A) has a functional group reacting with a functional group of the crosslinking agent (B), and the functional group of the crosslinking agent (B) is 1 equivalent or more relative to the functional group of the acrylic polymer (A). |
