| 摘要 |
PROBLEM TO BE SOLVED: To capture a high resolution image of a bottom face and a side face of an electronic component.SOLUTION: An electronic component mounting device includes a component feeding section for feeding an electronic component, a substrate transfer section for holding a substrate, a reflection mirror provided between the substrate transfer section and the component feeding section, a head including a nozzle for sucking the electronic component, and attaching the electronic component to a predetermined position of the substrate after passing above the reflection mirror, a camera provided in the head and having an optical path directing downward of the nozzle, a mirror for changing the optical path of the camera toward a side face of the electronic component sucked to the nozzle, an optical member drive section for moving the mirror forward and backward of the optical path, and a control section for making the camera capture the side face of the electronic component by advancing the mirror to the optical path, retracting the mirror therefrom when the head passes above the reflection mirror, and making the camera capture a bottom face of the electronic component reflected on the reflection mirror. |
