PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS
摘要
<p>The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.</p>
申请公布号
WO2013182489(A2)
申请公布日期
2013.12.12
申请号
WO2013EP61280
申请日期
2013.05.31
申请人
ATOTECH DEUTSCHLAND GMBH
发明人
BRUNNER, HEIKO;PICALEK, JAN;BEJAN, IULIA;KRAUSE, CARSTEN;BERA, HOLGER;RUECKBROD, SVEN
