| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of effectively suppressing a switching noise.SOLUTION: A semiconductor package 2 (semiconductor device) disclosed in the specification comprises switching elements 3a and 3b and bus bars 4, 5a, and 5b for transmitting power between the switching elements and an external device. The switching elements and parts of the bus bars are covered by a resin mold 9. A surface of the bus bar is provided with a carbon plated layer 7 having higher electric resistivity than the bus bar itself extending from the inside to the outside of the resin mold 9. |
