发明名称 PACKAGE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a package material having an excellent non-adsorbing property and a good gas barrier and heat-sealing properties.SOLUTION: A package material includes at least a substrate layer, a barrier layer, an anchor coat layer, and a sealant layer. In the package material, the anchor coat layer is obtained by hardening a composition mainly consisting of an epoxy resin composition comprising an epoxy resin and an epoxy resin hardener, and the sealant layer has a linear low-density polyethylene resin layer adjacent to the anchor coat layer and a cyclic polyolefin resin layer.
申请公布号 JP2013249070(A) 申请公布日期 2013.12.12
申请号 JP20120123048 申请日期 2012.05.30
申请人 DAINIPPON PRINTING CO LTD 发明人 YAMADA KENICHI;ITO KATSUNOBU
分类号 B65D65/40;B32B9/00;B32B27/38;B65D81/24 主分类号 B65D65/40
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