MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENTS MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To form a solder-joint part having sufficient intensity and durability by allowing a reducing activator contained in a flux to effectively act on each electrode while forming a solder-joint part.SOLUTION: The manufacturing method of electronic component mounting structure includes the steps of: applying a flux to plural solder bumps of electronic components; mounting the electronic components to a circuit member so that plural solder bumps applied with the flux land on the corresponding electrodes; and joining the electronic components to the circuit member by heating solder bump to melt and cooling the melt solder after being brought into contact with the electrodes. The flux includes base material containing fluid resin component of solid constituent particles. The solid constituent contains activator reducing metal oxide and flake-shape or scale-like metal powder. Average particle diameter of the activator is larger than an average thickness of the metal powder.