HEAT TRANSFER CAP, REPAIR DEVICE, AND REPAIR METHOD

摘要

PROBLEM TO BE SOLVED: To provide a heat transfer cap which unfailingly supplies heat to a solder joint part of an electronic component even when a multi-chip package is included in a wiring board as an electronic component joined thereto by solder, and to provide a repair device including the heat transfer cap.SOLUTION: A heat transfer cap 18 includes a cap part 18A which is attached to an electronic component joined to a wiring board by solder and has a side wall 18b contacting with a side surface of the electronic component during heating; and a ring part 18B attached to the outer side of the side wall of the cap part and having a linear expansion coefficient smaller than that of the cap part.