CONDUCTIVE PASTE MATERIAL, METHOD OF CONNECTING SEMICONDUCTOR ELEMENT, AND METHOD OF FORMING ELECTRODE

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste material excellent in sinterability at a low cost.SOLUTION: There is provided a conductive paste material comprising: metal powder 3 formed of complex metal foil obtained by stacking and cladding a substrate and a molten metal layer having a melting point lower than the substrate, and a solvent 4 to which the metal powder 3 is added.