发明名称 |
METHOD AND APPARATUS FOR PROVIDING IMPROVED BACKSIDE METAL CONTACTS TO SILICON CARBIDE |
摘要 |
Embodiments of a method and apparatus are disclosed for providing improved backside metal contacts to silicon carbide. Embodiments include depositing a barrier layer on the bottom surface of a silicon carbide wafer. The barrier layer is located between the silicon carbide wafer and a silicon layer. The silicon carbide wafer is separated into individual silicon carbide die. Embodiments further include mechanically scrubbing each silicon carbide die on the top surface of a package, forming a gold-silicon eutectic solder that bonds the silicon carbide die to the package. The barrier layer reduces or eliminates diffusion of species into the gold-silicon eutectic solder to reduce or eliminate voids in the gold-silicon eutectic solder. |
申请公布号 |
US2013330571(A1) |
申请公布日期 |
2013.12.12 |
申请号 |
US201213489904 |
申请日期 |
2012.06.06 |
申请人 |
VARMA RAMESH;KNIGHT THOMAS J.;NORTHROP GRUMMAN SYSTEMS CORPORATION |
发明人 |
VARMA RAMESH;KNIGHT THOMAS J. |
分类号 |
B23K31/02;B23K1/20;B32B7/10 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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