| 摘要 |
PROBLEM TO BE SOLVED: To provide support structures for electronic components, interconnects, interposers, and methods for their fabrication.SOLUTION: A signal carrier for supplying a signal in a direction within an X-Y plane of a multilayer composite electronic structure comprising a plurality of dielectric layers extending in the X-Y plane comprises a first transmission line comprising a lower continuous metallic layer, and further comprises a row of metallic via posts coupled to the continuous metal layer. The transmission line is separated by a dielectric material from an underlying reference plane. |
