| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, from which a sealed body excellent in reflow resistance can be formed, and to provide an electronic component device including an element encapsulated by the epoxy resin molding material for sealing.SOLUTION: An epoxy resin molding material for sealing contains an epoxy resin having two or more epoxy groups in one molecule thereof, a curing agent, and a carboxylic acid amide derivative having one or more phenolic hydroxy groups in one molecule thereof. An electronic component device includes an element encapsulated by the epoxy resin molding material for sealing. |
