| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head in which the possibility that air bubbles are interposed between a substrate and a drive IC can be reduced, and the reliability is improved.SOLUTION: A thermal head X1 includes a substrate 7, an exothermic part 9 provided on the substrate 7, a drive IC 11 which controls the voltage applied to the exothermic part 9, a joining member 10 which joins the substrate 7 and the drive IC 11, and a metal layer 12 which is provided on the substrate 2 and located below the drive IC 11. A coating layer 14 is provided on the surface of the metal layer 12. The joining member 10 is located between the coating layer 14 and the drive IC 11. |
