发明名称 POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER
摘要 Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.
申请公布号 WO2013184465(A1) 申请公布日期 2013.12.12
申请号 WO2013US43126 申请日期 2013.05.29
申请人 NEXPLANAR CORPORATION 发明人 LEFEVRE, PAUL ANDRE;ALLISON, WILLIAM C.;LACASSE, JAMES P.;SCOTT, DIANE;SIMPSON, ALEXANDER WILLIAM;HUANG, PING;CHARNS, LESLIE M.
分类号 B24B37/20;B24B37/22;B24B37/26;B24D11/00;B24D18/00 主分类号 B24B37/20
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