发明名称 MANUFACTURING METHOD OF A COOLING MODULE FOR A LIGHTING DEVICE
摘要 The purpose of the present invention is to provide a manufacturing method for the cooling module of a lighting device to simplify manufacturing processes and have excellent manufacturing efficiency by rapidly cooling an LED element and securing the operational reliability of products. In particular, provides is the manufacturing method for the cooling module of a lighting device to simplify the internal structure of a heat pipe; to improve assembling properties; to improve contact between the heat pipe and a radiation fin body, and thermal conductivity; to improve the appearance of a lighting device without the pipe body of a vacuous injection nozzle exposed to the outside; and to improve mounting properties with other components. [Reference numerals] (ST1) Pressing out a radiation fin;(ST10) vacuous injection of a thermal medium;(ST11) Thermocompression bonding and cutting an injection needle;(ST12) Charging and finishing resins;(ST13) Coating thermal grease;(ST14) Inputting a heat pipe;(ST2) Cutting a material pipe;(ST3) Processing a short protrusion on the inner circumference of the pipe;(ST4) Boring a cap;(ST5) Processing a fin hole;(ST6) Attaching the injection needle;(ST7) Attaching a lower cap;(ST8) Inserting a mesh;(ST9) Attaching an upper cap
申请公布号 KR101340977(B1) 申请公布日期 2013.12.12
申请号 KR20120104364 申请日期 2012.09.20
申请人 SEKI HI-TECK CO., LTD. 发明人 BAE, YOUNG KI;JUNG, BONG KI;SEO, JIN KOOK;KWON, YONG HYUN;LIM, KWANG WON
分类号 F21V29/00;F21V17/00 主分类号 F21V29/00
代理机构 代理人
主权项
地址