| 摘要 |
PROBLEM TO BE SOLVED: To provide means for improving a quality of a semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: by arranging a mask sheet 1 on a lower mold 4 such that the mask sheet covers a vacuum port 11 of the lower mold 4 and an opening 1b of the mask sheet 1 overlaps a substrate mounting surface 4d of the lower mold 4, and by supplying a resin for cleaning in a cavity, the resin for cleaning can be brought in contact with a cavity surface of an upper mold 3 and the substrate mounting surface 4d of the lower mold 4. With this configuration, contamination accumulated on the substrate mounting surface 4d can adhere to the resin for cleaning while preventing the resin for cleaning from getting entrance to the vacuum port 11. As a result, a quality of the semiconductor device is improved by successful cleaning of a molding die 2. |
