| 摘要 |
PROBLEM TO BE SOLVED: To provide a pallet for a substrate housing container and a package body for the substrate housing container which do not obstruct mechanical transportation even if the substrate housing container is not grasped from outside, eliminate the probability of breakage of a semiconductor wafer due to the substrate housing container shifted on the pallet during transportation, or the probability of damage of the semiconductor wafer due to vibration.SOLUTION: A pallet for a substrate housing container is configured to mount a substrate housing container for housing a semiconductor wafer having a diameter &phgr; of 450 mm, on a pallet 2. The substrate housing container has a gross weight of not less than 8 kgf, the pallet 2 has a substrate formed into a flat rectangular shape as a mounting surface, the peripheral edge of the mounting surface is at least partially provided with a positioning device 4 for the substrate housing container, the mounting surface of the pallet 2 is disposed with a plurality of elastic cushioning bodies 6 for the substrate housing container, and the elastic cushioning body 6 has a shore 00 hardness of 20° to 120°. The pallet 2 is excellent in transportability, so that even if the substrate housing container is difficult to grasp visually, mechanical transportation is not obstructed. |
