| 摘要 |
It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm. |
