发明名称 TEMPERATURE-CONTROLLED PURGE GATE VALVE FOR CHEMICAL VAPOR DEPOSITION CHAMBER
摘要 The present invention relates to methods and apparatus that are optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. Specifically, the methods relate to substantially preventing the formation of unwanted materials on an isolation valve fixture within a chemical vapor deposition (CVD) reactor. In particular, the invention provides apparatus and methods for limiting deposition/condensation of GaCl3 and reaction by-products on an isolation valve that is used in the system and method for forming a monocrystalline Group III-V semiconductor material by reacting an amount of a gaseous Group III precursor as one reactant with an amount of a gaseous Group V component as another reactant in a reaction chamber.
申请公布号 US2013327266(A1) 申请公布日期 2013.12.12
申请号 US201313966921 申请日期 2013.08.14
申请人 SOITEC 发明人 ARENA CHANTAL;WERKHOVEN CHRISTIAAN
分类号 C30B25/14 主分类号 C30B25/14
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