JOINING METHOD, JOINING DEVICE, CONTROLLER, AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To achieve joining capable of accurately controlling a melting temperature of solder to join a joining thing and a joined thing.SOLUTION: A joining method includes a first irradiation process for irradiating a laser beam of 15 W while moving an irradiation position of the laser beam in a substrate 10, a measurement process for measuring a temperature in the irradiation position one by one, and a second irradiation process for irradiating the laser beam of 22 W to the irradiation position where 240°C can be obtained.