发明名称 ELECTRONIC COMPONENT PACKAGE STRUCTURE
摘要 A thermistor includes a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate includes ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar defined by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the thermistor have a thickness of about 10 mum to about 80 mum and about 1 mum to about 10 mum, respectively.
申请公布号 US2013328154(A1) 申请公布日期 2013.12.12
申请号 US201313966514 申请日期 2013.08.14
申请人 MURATA MANUFACTURING CO., LTD 发明人 MIURA TADAMASA
分类号 H01L35/02;H01L35/34 主分类号 H01L35/02
代理机构 代理人
主权项
地址