HEAT TRANSFER MEMBER AND MODULE COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat transfer member capable of suppressing a gap in thermal expansion between the heat transfer member and a semiconductor element, and having a high heat radiation effect as well.SOLUTION: A heat transfer member 40 is provided between a semiconductor element 30 and an electrode plate 50. The heat transfer member 40 comprises a metal part 42 extending between a first surface 40A on a side of the semiconductor element 30 and a second surface 40B on a side of the electrode plate 50, and a ceramic part 44 surrounding the metal part 42. In the metal part 42, an area of the first surface 40A is smaller than an area of the second surface 40B.