A semiconductor wafer processing tool has a support structure (12) for a coarse motion positioning system (14). A measurement head (26) having a rigid super structure (28) is supported from the support structure by vibration isolators (30a, 30b) and a top plate (32) is mounted to the super structure. A vacuum transfer chuck (24) is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer (42).
申请公布号
WO2013184170(A2)
申请公布日期
2013.12.12
申请号
WO2013US20886
申请日期
2013.01.09
申请人
MULTIPROBE, INC.
发明人
ERICKSON, ANDREW, N.;MARKAKIS, JEFFREY, M.;RILEY, ANTON, L.