| 摘要 |
The present invention provides a resin part having high quality and produced by a simple manufacturing process, a photoelectric sensor using the resin part described above, and a method of manufacturing the resin part. A resin case includes a case (31) having a bonding surface (31c), and made of resin; an intermediate case (41) bonded to the bonding surface (31c) by welding, and made of resin that can transmit laser light; and a cap cover (21) arranged on the opposite side of the case (31) with respect to the intermediate case (41), standing on the intermediate case (41), and made of resin. The cap cover (21) includes a side portion (21a) standing from the intermediate case, and a top portion (21b) crossing the side portion (21a) on the position facing the bonding surface (31c) via the intermediate case (41). The height of the position (H) where the side portion (21a) and the top portion (21b) cross each other with the bonding surface (31c) being defined as a reference is the same on any position facing the bonding surface (31c). |
