| 发明名称 |
Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer |
| 摘要 |
The invention is directed to method for electroless deposition of a copper-layer on a semiconductor substrate, an electroless deposited copper layer as well as a semiconductor component comprising said electroless deposited copper layer. |
| 申请公布号 |
EP2672520(A1) |
申请公布日期 |
2013.12.11 |
| 申请号 |
EP20120171065 |
申请日期 |
2012.06.06 |
| 申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
SOARES CEASAR DA SILVA FRANCO, CIBELE |
| 分类号 |
H01L31/0224 |
主分类号 |
H01L31/0224 |
| 代理机构 |
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