| 摘要 |
<p>An object of the present invention is, in a circuit board production method which includes the step of forming a circuit pattern by irradiating, with laser light, a resin film that has been formed on the surface of an insulating substrate, to increase the laser light absorptance of the resin film and improve circuit board productivity. Use is made of a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when µ1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, µ1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).</p> |
