| 摘要 |
The present invention provides a method for preparing a pattern on a substrate and, more specifically, to a method for preparing two different kinds of patterns comprising: (1) a step of forming a photoresist by coating a two-layer film, which is formed on the substrate and contains a first layer and a second layer selected from the group consisting of an insulation layer and a conductive layer, with a photoresist composition; (2) a step of forming a first pattern by performing a first development process on the photoresist and by etching the first layer and second layer; (3) a step of forming a second pattern by performing a second development process on the photoresist and by etching the second layer; and (4) a step of removing the photoresist and performing washing. The method for preparing two different kinds of patterns according to the present invention can reduce the consumption of photosensitive materials and shorten the processing time. [Reference numerals] (AA) PR coating;(BB) Primarily develop PR;(CC) Etch a first layer and a second layer;(DD) Secondarily develop PR;(EE) Etch a first layer;(FF) Remove and wash PR;(GG) One coating and double patterning |
