| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive tape for sealing resin, and to provide a method of manufacturing a resin-sealed semiconductor device using the same adhesive tape ensuring superior anti-plasma properties, deterioration of no adhesive tape attached, and leaving of no paste, even when the steps including plasma treatment are conducted in the manufacturing steps of the semiconductor device. <P>SOLUTION: The heat-resistant adhesive tape 20 for sealing resin used for manufacturing the resin-sealed semiconductor device includes a basic material layer and an adhesive agent layer laminated on the basic material layer. In the adhesive tape, the adhesive agent layer is formed of a polymer, having the structure unit derived from the (meth)acrylic acid and a monomer element other than the (meth)acrylic acid and an adhesive agent containing epoxy-system bridging agent, the (meth)acrylic acid is contained in the 5 pts.wt. or more for the monomer element of 100 pts.wt., while the epoxy-system bridging agent is contained in the pts.wt. corresponding to the equivalent value of 0.4 or more for the (meth)acrylic acid. <P>COPYRIGHT: (C)2011,JPO&INPIT |
